Device for determining the quantity of material removed e.g. from a semiconductor wafer

the device has a grinding/polishing element moved relative to a table (44) holding the wafer (50) whilst one surface of the wafer is pressed against a surface of the grinding/polishing element (14). A differential transformer (60) has a coil and a core (64). The coil moves in contact with the table....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	INABA, TAKAO, MITAKA, TOKIO/TOKYO, JP, NUMOTO, MINORU, MITAKA, TOKIO/TOKYO, JP
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	the device has a grinding/polishing element moved relative to a table (44) holding the wafer (50) whilst one surface of the wafer is pressed against a surface of the grinding/polishing element (14). A differential transformer (60) has a coil and a core (64). The coil moves in contact with the table. A supporting element (66) supports the core of the transformer so as to hold the core at a constant distance from the surface of the grinding/polishing element. The quantity of material removed from the plate is determined by measuring the displacement of the coil wrt. the core as the plate is being ground/polished.