Modular miniatursied component soldering method

The soldering method has a layer of solder appllied to one side (4) of the miniaturised component (2) and a layer (6) of metal applied to the base plate (1) onto which the miniaturised component is to be mounted, before positioning the miniaturised component above the base plate and applying heat to...

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Bibliographische Detailangaben
1. Verfasser:	DE GRAFFENRIED, CHRISTIAN REMY, LA TOUR DE-PEILZ, CH
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The soldering method has a layer of solder appllied to one side (4) of the miniaturised component (2) and a layer (6) of metal applied to the base plate (1) onto which the miniaturised component is to be mounted, before positioning the miniaturised component above the base plate and applying heat to the latter, for melting the solder (5') so that it fills the gap between the surface of the base plate and the miniaturised component.