Verfahren zur Herstellung eines Mehrebenen-Verdrahtungsträgers (Substrat), insbesondere für Multichipmodule

The conductor track system is applied simultaneously to several individual substrates in several coating and microstructuring steps. Said substrates form a single piece and are separated only after structuring has occurred. In order to produce ready-made thin substrates, the individual substrates ar...

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Bibliographische Detailangaben
Hauptverfasser:	HEDLER, HARRY, 81377 MUENCHEN, DE, AMMANN, NORBERT, 82067 KLOSTER SCHAEFTLARN, DE
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The conductor track system is applied simultaneously to several individual substrates in several coating and microstructuring steps. Said substrates form a single piece and are separated only after structuring has occurred. In order to produce ready-made thin substrates, the individual substrates are processed at least during structuring in the form of a strip.