Adhesive premixture for flexible printed lead plate

A premixture for an adhesive for a flexible printed lead plate comprises: (a) 100 pts. wt. epoxy resin with two epoxy groups per mol.; (b) 30-100 pts. wt. rubber containing a functional group selected from -COOH, -CN and -OH; (c) 0.01-1.0 pts. wt. of a tert. amine as primary catalyst; (d) 100-400 pt...

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Bibliographische Detailangaben
Hauptverfasser:	LI, HSIAOIAN, HSINCHU, TW, TSENG, TSENG-YOUNG, TAOYUAN HSIEN, TW, HWANG, YEONG-TSYR, HSINCHU, TW
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A premixture for an adhesive for a flexible printed lead plate comprises: (a) 100 pts. wt. epoxy resin with two epoxy groups per mol.; (b) 30-100 pts. wt. rubber containing a functional group selected from -COOH, -CN and -OH; (c) 0.01-1.0 pts. wt. of a tert. amine as primary catalyst; (d) 100-400 pts. wt. solvent; and (e) 2-30 pts. wt. filler. Also claimed are (i) an adhesive comprising (a) - (e) as above and additionally, (f) 2-20 pts. wt. setting agent and (g) 0.1-10 pts. wt. setting catalyst; (ii) the preparation of the adhesive by forming a solution of (a)-(e) and pre-polymerising at 60-120 deg C, then mixing with 2-20 pts. wt. setting agent and 0.1-10 pts. wt. setting catalyst.