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The socket includes a socket case (1) which can be soldered to the circuit board by a reflow process. An opening is provided in the base of the case, through which the bent connector ends of the signal contacts of an insulating block extend to the corresponding conductor tracks on the circuit board,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JANKOWSKY, MEINRAD, 84513 TOEGING, DE, OBERSTARR, REINHARD, 84570 POLLING, DE
Format: Patent
Sprache:ger
Schlagworte:
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Beschreibung
Zusammenfassung:The socket includes a socket case (1) which can be soldered to the circuit board by a reflow process. An opening is provided in the base of the case, through which the bent connector ends of the signal contacts of an insulating block extend to the corresponding conductor tracks on the circuit board, where they are soldered as SMT contacts.