Elektrische Bauteilanordnung

An assembly comprises multiple discrete electrical components (10) and a frame (20) which is overmolded on the components to hold them in fixed relative positions. The frame has alignment pins (32,34, Fig. 2) which are registrable with holes in a circuit board, and a pad (26) configured for engageme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RAYMOND, HOLLIS PAUL, MECHANICSBURG, PA., US, GORENC, DANIEL LEE, HARRISBURG, PA., US
Format: Patent
Sprache:ger
Schlagworte:
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Beschreibung
Zusammenfassung:An assembly comprises multiple discrete electrical components (10) and a frame (20) which is overmolded on the components to hold them in fixed relative positions. The frame has alignment pins (32,34, Fig. 2) which are registrable with holes in a circuit board, and a pad (26) configured for engagement by pick and place assembly equipment. The components (10) may have slots (16) formed in their housings, which may be used to join the frame to the components during the molding process.