Thermoplastische Formmassen

The invention relates to thermoplastic molding materials containing A) 10 to 99 wt. % of a vinyl aromatic polymer with a syndiotactic pentadene content of 30 mol %, B) 0.1 to 20 % of delaminated stratified silicate (phyllosilicate), C) 0 to 50 wt. % other additives and processing agents, wherein the...

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Bibliographische Detailangaben
Hauptverfasser:	FISCHER, MICHAEL DR., 67071 LUDWIGSHAFEN, DE, RAUSCHENBERGER, VOLKER, 67069 LUDWIGSHAFEN, DE, RAUSCHENBERGER, VOLKER DR., 67069 LUDWIGSHAFEN, DE, HEITZ, THOMAS DR., 67125 DANNSTADT-SCHAUERNHEIM, DE, WARZELHAN, VOLKER DR., 67273 WEISENHEIM, DE, WOLF, PETER DR., 67281 KIRCHHEIM, DE, GEPRAEGS, MICHAEL DR., 67240 BOBENHEIM-ROXHEIM, DE, KLATT, MARTIN DR., 68165 MANNHEIM, DE, PLESNIVY, THOMAS DR., 67067 LUDWIGSHAFEN, DE, GRUTKE, STEFAN DR., 67434 NEUSTADT, DE, WEBER, MARTIN DR., 67487 MAIKAMMER, DE, WUENSCH, JOSEF DR., 67105 SCHIFFERSTADT, DE
Format:	Patent
Sprache:	ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to thermoplastic molding materials containing A) 10 to 99 wt. % of a vinyl aromatic polymer with a syndiotactic pentadene content of 30 mol %, B) 0.1 to 20 % of delaminated stratified silicate (phyllosilicate), C) 0 to 50 wt. % other additives and processing agents, wherein the weight percentages of constituents A) to C) amount to 100 %.