Leiterrahmen und Montagevorbereitungsverfahren für einen Leiterrahmen
The metallic lead frame (1) is coated on one or both sides with a polymeric adhesion promoter (2). Preferably, the polymer is applied by electrodeposition and has openings (3) at contact faces (4) of the lead frame body (1). Also claimed is a mounting preparation process for the above lead frame.
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| Format: | Patent |
| Sprache: | ger |
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| Zusammenfassung: | The metallic lead frame (1) is coated on one or both sides with a polymeric adhesion promoter (2). Preferably, the polymer is applied by electrodeposition and has openings (3) at contact faces (4) of the lead frame body (1). Also claimed is a mounting preparation process for the above lead frame. |
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