Gehäuse für Mehrchimpmodule
A module technology allows a PGA like package architecture to be used in microwave instruments and other high frequency systems where high isolation, low reflection, and low cost multi-chip modules are needed.
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| Format: | Patent |
| Sprache: | ger |
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| Zusammenfassung: | A module technology allows a PGA like package architecture to be used in microwave instruments and other high frequency systems where high isolation, low reflection, and low cost multi-chip modules are needed. |
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