Device for separating wires, etc. from wire bundle, etc

The device (1) incorporates a feed plane (3) inclined in the feed direction (5) to receive a wire bundle (13) and a centrally arranged guide component (6) with a control gap (16). The control gap width corresponds to the wire diameter and accommodates the separated wires in a single layer (14). Befo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RAPPOLD, DIETMAR, DIETIKON, CH, MEIER, ROBERT, WETTSWIL, CH
Format: Patent
Sprache:eng ; ger
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Beschreibung
Zusammenfassung:The device (1) incorporates a feed plane (3) inclined in the feed direction (5) to receive a wire bundle (13) and a centrally arranged guide component (6) with a control gap (16). The control gap width corresponds to the wire diameter and accommodates the separated wires in a single layer (14). Before the bundle is received in the control gap, it is processed by several processing components (8.1,8.2,9.1,9.2,10.1,10.2), which are arranged on both sides of the guide component and have a spreading edge parallel to the feed plane and a discharge edge directed against the wire bundle. A drive mechanism is so formed that the processing components execute a stretch movement. In a first cycle section of the spreading movement, the spreading edge, commencing from a starting point (A1), is guided over the single wire layer. In a second cycle section, the stretch edge is raised from the wire layer.