Verfahren zum Verbinden elektrischer Anschlüsse mit elektrischen Kontaktfeldern

In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in tu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AZDASHT, GHASSEM, AKHAVAIN, MOHAMMAD
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CORRECTION OF TYPOGRAPHICAL ERRORS CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINE CONNECTORS LINING MACHINES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING STAMPS TRANSPORTING TYPEWRITERS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream-and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead-with the bumps formed on a die or other printhead component, and nozzles formed through the base.