Kassette zur Halbleiterbauelementfertigung, Herstellungsverfahren hierfür und diese verwendende Halbleiterbauelement-Fertigungsanlage

A wafer cassette, a method for manufacturing such a cassette, and equipment for semiconductor fabrication are provided. The cassette includes a container (50) for containing wafers, a bar-code wing (55,60) projecting outward from at least one of the walls of the container, and a bar code (65) formed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AHN, CHUNG-SAM, YONGIN, KYUNGKI, KR, LIM, YONG-IL, YONGIN, KYUNGKI, KR
Format:	Patent
Sprache:	ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	A wafer cassette, a method for manufacturing such a cassette, and equipment for semiconductor fabrication are provided. The cassette includes a container (50) for containing wafers, a bar-code wing (55,60) projecting outward from at least one of the walls of the container, and a bar code (65) formed on the surface of the bar-code wing. A bar code reader (75) for identifying the bar codes (65) of the cassette (50) is provided below the upper plane of the loader/unloader portion of the equipment for semiconductor fabrication. Accordingly, an efficient loading/unloading operation of a cassette onto/from the loader/unloader portion of the equipment is enabled, wafer damage is reduced, and productivity of the manufactured semiconductor device is improved. The cassette and bar-code wings may be molded.