Halbleiter-Drucksensor
A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention gr...
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| creator | ICHIHASHI, MOTOMI |
| description | A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm. |
| format | Patent |
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Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm.</description><edition>6</edition><language>ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010517&DB=EPODOC&CC=DE&NR=19603279C2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010517&DB=EPODOC&CC=DE&NR=19603279C2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHIHASHI, MOTOMI</creatorcontrib><title>Halbleiter-Drucksensor</title><description>A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. 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The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Halbleiter-Drucksensor |
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