Halbleiter-Drucksensor

A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention gr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	ICHIHASHI, MOTOMI
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm.