Chipmodul

The object of the invention is to prevent delamination between the covering compound and the chip in the hot-melt assembly process. According to the invention, this object is achieved in that the heat flow introduced from the exterior into the chip module is controlled in a deliberate manner, either...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	STECKHAN, HANS., 81827 MUENCHEN, DE, KIRSCHBAUER, JOSEF., 93476 BLAIBACH, DE, HOUDEAU, DETLEF.., 84085 LANGQUAID, DE, STAMPKA, PETER. , 92421 SCHWANDORF, DE, MENSCH, HANS., 92431 NEUNBURG, DE
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	The object of the invention is to prevent delamination between the covering compound and the chip in the hot-melt assembly process. According to the invention, this object is achieved in that the heat flow introduced from the exterior into the chip module is controlled in a deliberate manner, either by a heat-insulating layer (9) interposed between the flexible carrier strip (2) of the chip module and the chip (3) bonded thereon, or by recesses (11) in the surface or layer of the metal contacts (10) such that heat is prevented from flowing from a hollow stamp (1) placed in the outer region of the metal contacts (10) in the direction of the centrally-mounted chip (3).