Thermo-Waferhaltevorrichtung vom Kontakttyp und Verfahren zu ihrer Herstellung

Thermo-Waferhaltevorrichtung vom Kontakttyp und Verfahren zu ihrer Herstellung

A thermo chuck for rapidly repeating periodical heating and cooling of a wafer during a photolithographic process is provided with a polytetrafluorethylene coating layer (37) having excellent heat-resistance and adhesive strength between the wafer and an anodized oxide layer 35. The coating layer pr...

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Bibliographische Detailangaben
Hauptverfasser: YIM, KA-SOON, SUWON, KR, KIM, SANG-WON, SUWON, KR, KANG, BYONG-JIN, SUWON, KR, SIM, KYUNG-BO, SUWON, KR
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A thermo chuck for rapidly repeating periodical heating and cooling of a wafer during a photolithographic process is provided with a polytetrafluorethylene coating layer (37) having excellent heat-resistance and adhesive strength between the wafer and an anodized oxide layer 35. The coating layer prevents flaking of the anodized-oxide layer through contact with the wafer, and thereby preventing contamination of the wafer's rear surface.