Elektronisches Bauteil für Oberflächenmontage (SMT)

The component has an insulating carrier element (10) and at least one electrically conducting conductor element (20) attached to it with a contact region (22) lying freely outside the carrier element to enable the component to be connected to a circuit board (30). At least one window (16) in the car...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	OBERSTARR, REINHARD, 84570 POLLING, DE
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS RESISTORS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The component has an insulating carrier element (10) and at least one electrically conducting conductor element (20) attached to it with a contact region (22) lying freely outside the carrier element to enable the component to be connected to a circuit board (30). At least one window (16) in the carrier element enables infrared radiation to pass through to the contact region. The window is an opening in the carrier element. The conductor element passes through the carrier element to form the contact region on one side of the carrier element and a free-lying contact part (24) on the other side of the carrier element.