Micro cooling mounting unit for electronic device

The micro cooling system has a laminated structure formed with top and bottom plates (1) between which are strip elements that allow fluid flow channels (12) to be formed in parallel. Wedge shaped channels are formed that feed these parallel channels and a cooling fluid is supplied (4) to one of the...

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Bibliographische Detailangaben
Hauptverfasser:	FUESER, HANS-JUERGEN. DR., 89547 GERSTETTEN, DE, HEINAU, MARTINA., 89075 ULM, DE, GUTHEIT, TIM., 89073 ULM, DE, ZACHAI, REINHARD. DR., 89312 GUENZBURG, DE
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESISTORS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The micro cooling system has a laminated structure formed with top and bottom plates (1) between which are strip elements that allow fluid flow channels (12) to be formed in parallel. Wedge shaped channels are formed that feed these parallel channels and a cooling fluid is supplied (4) to one of them and exits (5) from the other. The shape of the inlet and outlet channels provide uniform cooling conditions. The electronic components are mounted on the outer surface of the plates.