Komposit-Struktur und Verfahren zu deren Herstellung

A composite structure for electronic components, having a base substrate with a flat side provided with a depression, and having a cover layer which is disposed on the flat side structured by the depression, and the depression being covered to form a hollow structure. The depression in the base subs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUESER, HANS-JUERGEN. DR., 89547 GERSTETTEN, DE, FERGUSON, MONA., 89081 ULM, DE, SCHAUB, REINER., 64297 DARMSTADT, DE, GUTHEIT, TIM., 89073 ULM, DE, MUENCH, WOLFRAM. DR., 68165 MANNHEIM, DE, GREEB, KARL-HEINRICH, 63303 DREIEICH, DE, ZACHAI, REINHARD. DR., 89312 GUENZBURG, DE
Format: Patent
Sprache:ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A composite structure for electronic components, having a base substrate with a flat side provided with a depression, and having a cover layer which is disposed on the flat side structured by the depression, and the depression being covered to form a hollow structure. The depression in the base substrate is created prior to the deposition of the cover layer and has a clear width measured parallel to the flat side that is less than one-half of its clear depth measured before the cover layer is applied. The vapor phase deposited cover layer is formed from a material which has a sufficiently high surface tension to promote three-dimensional growth of the vapor phase deposited layer.