Chip carrier system for planar electronic module

Chip carrier system for planar electronic module

The planar electronic module carries a planar, electric, interconnecting boundary face device. The chip carrier system (10) has a support-frame (12) with peripheral body region and a redn in its lower face for the boundary face device. A central recess (22) ends in a floor (26) and retains a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IRLBECK, ROBERT DANIEL, GREENSBORO, N.C., US, VOLZ, KEITH L., JAMESTOWN, N.C., US, DEAK, FREDERICK ROBERT, KERNERSVILLE, N.C., US, RENN, ROBERT MAURICE, PFAFFTOWN, N.C., US
Format: Patent
Sprache:eng ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The planar electronic module carries a planar, electric, interconnecting boundary face device. The chip carrier system (10) has a support-frame (12) with peripheral body region and a redn in its lower face for the boundary face device. A central recess (22) ends in a floor (26) and retains a second electronic module (18). A force application element engages the second electronic module and has a number of ribs for location over section of downwards converging side walls (24). On engagement of the force application element with the frame, the ribs form a control surface inwards in contact with the connecting leads of the second module to bring them into contact with a resilient electric connector (32) at the boundary face device.