Printed circuit manufacture using laminates - containing catalyst for non electrolytic

Printed circuit manufacture using laminates - containing catalyst for non electrolytic

The laminate is coated with an etch resist before immersion in the etchin bath as in the principal patent. The areas of the laminate exposed i.e. not coated with etch resist, are coated before immersion in the etching bath with a contact adhesive containing the catalyst. The adhesive agent is applie...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HELMUT FASBENDER,ER.NAT
Format: Patent
Sprache:eng ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The laminate is coated with an etch resist before immersion in the etchin bath as in the principal patent. The areas of the laminate exposed i.e. not coated with etch resist, are coated before immersion in the etching bath with a contact adhesive containing the catalyst. The adhesive agent is applied in the interstices by screen printing or by integral casting using a runner. The latter is operated by a program controlled mechanism.