Printed circuit production

Printed circuit production

An uncoated insulating board is coated on both sides with a non-catalysed resist layer as in 1,765,350. A photosensitive catalysed layer is then deposited on the resist and exposed to the required conductor pattern. This is then developed to remove the unwanted parts of the layer and the subjected t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HELMUT FASBENDER,ER.NAT
Format: Patent
Sprache:eng ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An uncoated insulating board is coated on both sides with a non-catalysed resist layer as in 1,765,350. A photosensitive catalysed layer is then deposited on the resist and exposed to the required conductor pattern. This is then developed to remove the unwanted parts of the layer and the subjected to an electroless copper plating bath to form the conductor pattern, including the walls of through-going holes.