Thermoelektrische Vorrichtung

1,231,312. Thermoelectric devices. SIEMENS A.G. 25 July, 1969 [25 July, 1968], No. 37606/69. Heading H1K. A thermoelectric assembly comprises a plurality of P-type members disposed on one face of a planar insulating substrate and a plurality of N-type members disposed on the opposite face, the members being connected PNPN . . . by conductive layers on the edge of the plate so that current flows through them parallel to the plate. The P and N members, preferably of bismuth telluride, may be attached to opposite faces of a common sintered aluminium silicate or plastics substrate or to separate substrates held together by adhesive. The conductive layers may be vapour deposited or printed or painted on as a paste which is then flashed, and reinforced by electroplating, or formed by shape etching foils soldered to the entire edges of the substrate. The P and N members can be formed by vapour deposition but are preferably formed by cutting or etching larger slabs of material which have been stuck to substrates. Assemblies may be formed into a stack to form a larger unit.