Halbleiterelement

Halbleiterelement

1,164,551. Semi-conductor devices. BROWN, BOVERI & CO. Ltd. 18 May, 1967 [20 May, 1966], No. 23055/67. Heading H1K. A gas-tight casing for a semi-conductor device comprises inner and outer members 7, 6, e.g. of metal, joined respectively to an electrode 3 alloyed to the surface of the wafer 4 to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: EDOUARD EUGSTER, SPICKENREUTHER,DIETER
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:1,164,551. Semi-conductor devices. BROWN, BOVERI & CO. Ltd. 18 May, 1967 [20 May, 1966], No. 23055/67. Heading H1K. A gas-tight casing for a semi-conductor device comprises inner and outer members 7, 6, e.g. of metal, joined respectively to an electrode 3 alloyed to the surface of the wafer 4 to form a PN junction, and to a support plate 2. The gastight annular space 5 protecting the junction is completed by an insulating ring 8, e.g. of glass or ceramic. Pressure contacts 9, 10 are then applied to the device. A series stack of diodes may be arranged in such a casing.