VERFAHREN ZUR HERSTELLUNG EINES OPTOELEKTRONISCHEN BAUELEMENTS UND OPTOELEKTRONISCHES BAUELEMENT

The invention relates to a method for producing an optoelectronic component (1), said method having the following steps: - providing a carrier (2); - applying a plurality of semiconductor chips (3) to the carrier (2), wherein the semiconductor chips (3) are applied spaced apart from one another in such a way that cavities (4) are formed between the semiconductor chips (3); - introducing a photoimageable material (5), wherein at least the cavities (4) are filled with the photoimageable material (5); - exposing (6) the photoimageable material (5), wherein parts of the photoimageable material (5) which are downstream of the semiconductor chips (3) with respect to the exposure (6) remain unexposed; - removing unexposed parts of the photoimageable material (7), wherein recesses (10) are formed; - applying a functional layer (11) to the semiconductor chips (3); - removing the exposed photoimageable material (8). The invention also relates to an optoelectronic component (1) which is produced by means of said method.