VERKAPSELUNG VON SEITENEMITTIERENDEN LASERPACKAGES MITTELS VACUUM INJECTION MOLDING
The invention relates to a light-emitting component (1) comprising at least one light-emitting semiconductor element (4) which is arranged on a carrier (3) and is at least partially surrounded by a cap (9) with a light exit surface (10), the cap (9) being produced by means of a vacuum injection mold...
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| Zusammenfassung: | The invention relates to a light-emitting component (1) comprising at least one light-emitting semiconductor element (4) which is arranged on a carrier (3) and is at least partially surrounded by a cap (9) with a light exit surface (10), the cap (9) being produced by means of a vacuum injection molding method. |
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