Verfahren zum Herstellen eines optoelektronischen Bauelements

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Keith, Christina, Wiesmann, Christopher, Reeswinkel, Thomas, Leisen, Daniel, Richter, Daniel, Linkov, Alexander, Dinu, Emilia, Brunner, Herbert, Pindl, Markus, Peyker, Ludwig, Eberhard, Jens
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.