Einbau eines faseroptischen Temperatursensors in eine Kokille und Kokille mit mehreren faseroptischen Temperatursensoren

The invention relates to the installation of a fiber-optic temperature sensor (7) into an ingot mold (12) and the ingot mold (12) having a plurality of fiber-optic temperature sensors (7). The problem addressed by the invention is that of improving the installation of a fiber-optic temperature senso...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Schuster, Martin, Blumenschein, Johann, Leitner, Günter
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:The invention relates to the installation of a fiber-optic temperature sensor (7) into an ingot mold (12) and the ingot mold (12) having a plurality of fiber-optic temperature sensors (7). The problem addressed by the invention is that of improving the installation of a fiber-optic temperature sensor (7) into the copper plate (1, 13, 14) of the ingot mold (12) in such a way that the copper plate (1, 13, 14) is weakened only little by the holes (6) and that the costs for the installation of the temperature sensor (7) are greatly reduced in comparison with erosion. Said problem is solved by a method according to claim 1.