Anordnung zur lötfreien Kontaktierung von Leiterplatten

The invention relates to an arrangement (1) consisting of a circuit board (2) having at least one contact point (3) which is connected to at least one conductor path (4) of the circuit board (2), and a contact element (6) for solderless contacting of the contact point (3). According to the present invention, in order to create a press-fit connection with the circuit board (2) the contact element is a press-fit contact (6), and the contact point (3) is configured as a contact slot (3.1) starting at the edge (2.1) of the circuit board (2) and having a metallization (4.1) connected to the conductor path (4), wherein, in a horizontal position relative to the circuit board (2), the press-fit contact (6) is pressed into the contact slit (3.1) perpendicularly in relation to the circuit board and extends horizontally to the circuit board (2) beyond the edge (2.1) thereof. The invention further relates to a circuit board as well as to a press-fit contact to realize the arrangement according to the present invention.