Harzzusammensetzung, blattförmig ausgebildeter Körper, Prepreg, gehärteter Körper, Laminat und Mehrschichtlaminat

Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI, TAKAYUKI, KOUYANAGI, HIROSHI, GOTO, NOBUHIRO, HEISHI, MASARU
Format:	Patent
Sprache:	ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.