Active wafer probe
The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432,...
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creator | STRID, ERIC GLEASON, K. REED |
description | The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422). |
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REED</creatorcontrib><title>Active wafer probe</title><description>The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBByTC7JLEtVKE9MSy1SKCjKT0rlYWBNS8wpTuWF0twMam6uIc4euqkF-fGpxQWJyal5qSXxLq6GhkYGBiYGBkampiYhIabGRCsEACHTIgQ</recordid><startdate>20061123</startdate><enddate>20061123</enddate><creator>STRID, ERIC</creator><creator>GLEASON, K. REED</creator><scope>EVB</scope></search><sort><creationdate>20061123</creationdate><title>Active wafer probe</title><author>STRID, ERIC ; GLEASON, K. 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REED</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Active wafer probe</title><date>2006-11-23</date><risdate>2006</risdate><abstract>The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
title | Active wafer probe |
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