Active wafer probe

The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432,...

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Bibliographische Detailangaben
Hauptverfasser: STRID, ERIC, GLEASON, K. REED
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).