Kupfer-Nickel-Silizium Zwei-Phasen Abschrecksubstrat

A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructu...

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Hauptverfasser: WALLS, DALE R, MILLURE, DAVID W, BYE, RICHARD L, SCHUSTER, GARY B. A, DECRISTOFARO, NICHOLAS J, COX, JOSEPH C, LIN, JENG S, MYOJIN, SHINYA
Format: Patent
Sprache:ger
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Zusammenfassung:A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.