Marking semiconductor wafers by converting identification numbers into binary coded pattern which is projected bit by bit onto resist layer, followed by etching

A resist (4) is applied to the surface of the semiconductor wafer (2), which includes a substrate (1). The projector (3) shades (6) limit the field of illumination during photolithographic projection. The wafer is laid on a moveable substrate holder in the projection apparatus. From a prepared ident...

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Bibliographische Detailangaben

Hauptverfasser:	BRUCH, JENS UWE, HASSE, HOLGER, KISS, ANDREAS
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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