Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten
A contact point (3, 4) for an electric component (2), provided with a rough surface with elevations which pass through an insulating layer enabling contact to be established between a conductor (6) and the component (2).
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| creator | WEIDNER, KARL ZAPF, JOERG |
| description | A contact point (3, 4) for an electric component (2), provided with a rough surface with elevations which pass through an insulating layer enabling contact to be established between a conductor (6) and the component (2). |
| format | Patent |
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| language | ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten |
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