Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten

A contact point (3, 4) for an electric component (2), provided with a rough surface with elevations which pass through an insulating layer enabling contact to be established between a conductor (6) and the component (2).

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Bibliographische Detailangaben
Hauptverfasser:	WEIDNER, KARL, ZAPF, JOERG
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A contact point (3, 4) for an electric component (2), provided with a rough surface with elevations which pass through an insulating layer enabling contact to be established between a conductor (6) and the component (2).