Structuring treatment of surface with edge, on which protection layer is deposited and then removed by etching together with edge

Surface (1) with edge (4) is provided with protection layer of photo lacquer on edge. Both protection layer and edge are subject to etching for edge removal in structuring design (2) leading from first flat region to second such region. Preferably protective layer is so deposited that it is thinner...

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Bibliographische Detailangaben
1. Verfasser:	REBHAN, MATTHIAS
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Surface (1) with edge (4) is provided with protection layer of photo lacquer on edge. Both protection layer and edge are subject to etching for edge removal in structuring design (2) leading from first flat region to second such region. Preferably protective layer is so deposited that it is thinner on edge than in adjacent sections. Foil may be used as protective layer. Typically surface with edge is surface of printed circuit board or semiconductor, with edge formed by two planes of crystal grid. Independent claims are included for product with MEMS. Eine Oberfläche mit einer Kante wird zum Abrunden der Kante mit einer Schutzschicht bedeckt und die Schutzschicht sowie die Kante werden zumindest teilweise weggeätzt.