Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung

The method involves determining position information for an adjustment mark in a given direction using an optical measuring technique optimized for position determination. A line profile of the adjustment mark is determined in the given direction using an optical measuring technique optimized for pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	STAECKER, JENS
Format:	Patent
Sprache:	ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS REGULATING SEMICONDUCTOR DEVICES SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES TESTING
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Beschreibung
Zusammenfassung:	The method involves determining position information for an adjustment mark in a given direction using an optical measuring technique optimized for position determination. A line profile of the adjustment mark is determined in the given direction using an optical measuring technique optimized for profile determination, and used to correct the position information. Second position information for the adjustment mark in the given direction is determined and used to position and/or model the semiconductor wafer. An independent claim is included for an apparatus for carrying out the method.