Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself
The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent cl...
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creator | STEINHAUSER, UWE |
description | The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent claim is also included for a housing, especially for an electronic component.
Es wird eine Dichtplatte (1) beziehungsweise ein Gehäuse mit einer Dichtplatte vorgeschlagen, wobei die Dichtplatte (1) aus einem Gel besteht. Örtlich begrenzte Bereiche (2) der Dichtplatte sind miteinander vernetzt und weisen im Vergleich zum Gel eine größere mechanische Stabilität auf. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE10202601A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE10202601A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE10202601A13</originalsourceid><addsrcrecordid>eNqNjcFOw0AMRHPhUBX-wXxApaRI3Ks2qHe4V85mkqzk2NGuW6m_xReyAcSZk0czb8ab6vMdLFFHWoQdNFiiya55dVYNQfBkGgMFmxdTqBelOWbPZAMxjRBi7UkssMidOrtqj544gb8Rn_ADJVBURxIOa146E99KVsDi0owwcfnEQtm5ixL9XsqsfwvRM2R4rB4Gloyn37utnt_aj-N5h8UuyEtZV_jl1Db1vt6_1s2hefkP8wWjzVsd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself</title><source>esp@cenet</source><creator>STEINHAUSER, UWE</creator><creatorcontrib>STEINHAUSER, UWE</creatorcontrib><description>The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent claim is also included for a housing, especially for an electronic component.
Es wird eine Dichtplatte (1) beziehungsweise ein Gehäuse mit einer Dichtplatte vorgeschlagen, wobei die Dichtplatte (1) aus einem Gel besteht. Örtlich begrenzte Bereiche (2) der Dichtplatte sind miteinander vernetzt und weisen im Vergleich zum Gel eine größere mechanische Stabilität auf.</description><edition>7</edition><language>eng ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030731&DB=EPODOC&CC=DE&NR=10202601A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030731&DB=EPODOC&CC=DE&NR=10202601A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>STEINHAUSER, UWE</creatorcontrib><title>Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself</title><description>The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent claim is also included for a housing, especially for an electronic component.
Es wird eine Dichtplatte (1) beziehungsweise ein Gehäuse mit einer Dichtplatte vorgeschlagen, wobei die Dichtplatte (1) aus einem Gel besteht. Örtlich begrenzte Bereiche (2) der Dichtplatte sind miteinander vernetzt und weisen im Vergleich zum Gel eine größere mechanische Stabilität auf.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjcFOw0AMRHPhUBX-wXxApaRI3Ks2qHe4V85mkqzk2NGuW6m_xReyAcSZk0czb8ab6vMdLFFHWoQdNFiiya55dVYNQfBkGgMFmxdTqBelOWbPZAMxjRBi7UkssMidOrtqj544gb8Rn_ADJVBURxIOa146E99KVsDi0owwcfnEQtm5ixL9XsqsfwvRM2R4rB4Gloyn37utnt_aj-N5h8UuyEtZV_jl1Db1vt6_1s2hefkP8wWjzVsd</recordid><startdate>20030731</startdate><enddate>20030731</enddate><creator>STEINHAUSER, UWE</creator><scope>EVB</scope></search><sort><creationdate>20030731</creationdate><title>Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself</title><author>STEINHAUSER, UWE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE10202601A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>STEINHAUSER, UWE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>STEINHAUSER, UWE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself</title><date>2003-07-31</date><risdate>2003</risdate><abstract>The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent claim is also included for a housing, especially for an electronic component.
Es wird eine Dichtplatte (1) beziehungsweise ein Gehäuse mit einer Dichtplatte vorgeschlagen, wobei die Dichtplatte (1) aus einem Gel besteht. Örtlich begrenzte Bereiche (2) der Dichtplatte sind miteinander vernetzt und weisen im Vergleich zum Gel eine größere mechanische Stabilität auf.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself |
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