Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself

Sealing plate for housing for electronic component consists of a gel and locally bounded areas of the gel are interlaced and have greater mechanical stability than the gel itself

The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent cl...

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Bibliographische Detailangaben
1. Verfasser: STEINHAUSER, UWE
Format: Patent
Sprache:eng ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Zusammenfassung:The sealing plate (1) consists of a gel and locally bounded areas (2) of the gel are interlaced and have greater mechanical stability than the gel itself. The interlaced areas are formed by irradiating energy into the gel through a mask or by traversing the gel with a focused beam. AN Independent claim is also included for a housing, especially for an electronic component. Es wird eine Dichtplatte (1) beziehungsweise ein Gehäuse mit einer Dichtplatte vorgeschlagen, wobei die Dichtplatte (1) aus einem Gel besteht. Örtlich begrenzte Bereiche (2) der Dichtplatte sind miteinander vernetzt und weisen im Vergleich zum Gel eine größere mechanische Stabilität auf.