Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool

Wire bonding system (300) comprises a bonding head, a bonding tool (302) carried by the bonding head, a wire supply, which is formed for bonding using the bonding tool, and a wire shaping tool, which is carried by the bonding head, and is independently movable with respect to the bonding head and th...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BYARS, JONATHAN MICHAEL
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!