Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool

Wire bonding system (300) comprises a bonding head, a bonding tool (302) carried by the bonding head, a wire supply, which is formed for bonding using the bonding tool, and a wire shaping tool, which is carried by the bonding head, and is independently movable with respect to the bonding head and the bonding tool. An independent claim is also included for forming a wire loop, comprising (a) bonding a first region of a wire from a wire supply, to a first bonding site of a substrate using a wire bonding tool, which is carried by the bonding head, (b) conducting the wire from the first bonding site to an elevated position above the first bonding site, (c) forming a second region of the wire in the vicinity of the elevated position, for forming a bend using the wire shaping tool, which is carried by the bonding head, and is movable with respect to the bonding head and the wire bonding tool, (d) conducting the wire to a second bonding site of the substrate, and (e) bonding a third region of the wire to the second bonding site using the wire bonding tool. Es wird ein Draht-Bondystem bereitgestellt. Das System umfasst einen Bondkopf, ein von dem Bondkopf getragenes Bondwerkzeug, einen Drahtvorrat, der zum Bonden mittels des Bondwerkzeugs ausgebildet ist; und ein von dem Bondkopf getragenes Draht-Formgebungswerkzeug. Das Draht-Formgebungswerkzeug ist bezüglich des Bondkopfs und des Bondwerkzeugs unabhängig beweglich.