Press hardening a circuit board, by inserting printed circuit board into press hardening tool, and subjecting board with first pressing force and second pressing force that is applied independently to first pressing force
The method comprises: inserting a printed circuit board (7) into a press hardening tool (1) comprising two pressing elements (15, 15') that are movable transversely to a main direction of the tool; subjecting the printed circuit board with a first pressing force in the main direction; moving th...
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Format: | Patent |
Sprache: | eng ; ger |
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Zusammenfassung: | The method comprises: inserting a printed circuit board (7) into a press hardening tool (1) comprising two pressing elements (15, 15') that are movable transversely to a main direction of the tool; subjecting the printed circuit board with a first pressing force in the main direction; moving the pressing elements transversely to the main direction; and subjecting the printed circuit board with a second pressing force transverse to the main direction of the pressing elements, where the second pressing force is applied independently of the first pressing force. The method comprises: inserting a printed circuit board (7) into a press hardening tool (1) comprising two pressing elements (15, 15') that are movable transversely to a main direction of the tool; subjecting the printed circuit board with a first pressing force in the main direction; moving the pressing elements transversely to the main direction; and subjecting the printed circuit board with a second pressing force transverse to the main direction of the pressing elements, where the second pressing force is applied independently of the first pressing force. The second pressing force is applied to a portion of the board having a trim angle of less than 3[deg] , preferably 0[deg] . The first pressing force is increased while the second pressing force is applied to the circuit board, where the first pressing force and the second pressing force are chosen to be equal, and the contact pressure applied by the first and the second pressing forces is 0.01-0.5 MPa. An independent claim is included for a tool for press hardening a printed circuit board.
Es wird ein Verfahren zum Presshärten einer Platine (7) mit folgenden Schritten vorgeschlagen: - Einbringen einer Platine (7) in ein Werkzeug (1) zum Presshärten, das mindestens zwei quer zu einer Hauptwirkrichtung des Werkzeugs (1) verlagerbare Presselemente (15, 15') aufweist; - Beaufschlagen der Platine (7) mit einer ersten Presskraft in Hauptwirkrichtung, und - Verlagern der mindestens zwei Presselemente (15, 15') quer zu der Hauptwirkrichtung, und - Beaufschlagen der Platine (7) mit einer zweiten Presskraft quer zu der Hauptwirkrichtung durch die mindestens zwei Presselemente (15, 15'), wobei - die zweite Presskraft unabhängig von der ersten Presskraft aufgebracht wird. |
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