Magnetron sputtering device, used to perform vacuum-based physical vapor deposition for coating substrate with target material, includes magnet assembly that concentrates plasma over target surface and comprises hydraulic actuator
The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surfa...
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| creator | HEINRICH, HANS-JUERGEN. |
| description | The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction. The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction opposite to the first operating direction, is present operating connection with the hydraulic actuator or the magnet assembly, and is movable in the second operating direction. The restoring member is a further hydraulic actuator. The hydraulic actuators are arranged to each other such that directions of the actuator are perpendicular to each other. The hydraulic actuator is configured as a hydraulic cylinder and as a hydraulic muscle. The magnetron sputtering device further comprises a coolant inlet and a coolant outlet for cooling of the target and the magnet assembly by a cooling agent, and a control valve (8) for controlling a flow rate of a hydraulic fluid to the hydraulic actuator. The inlet and outlet are arranged on a hydraulic fluid port of the hydraulic actuator such that a partial volume of a flow of the coolant is used as the hydraulic fluid for the hydraulic actuator. The control valve is arranged so to the flow of the hydraulic fluid is moved to a first end position of the magnet assembly in first operating direction and the flow of the hydraulic fluid is moved to a second end position of the magnet assembly in the second operating direction. The magnet assembly is movable in the first operating direction.
Die Erfindung, welche eine Magnetronsputtereinrichtung betrifft, wie sie zu |
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Die Erfindung, welche eine Magnetronsputtereinrichtung betrifft, wie sie zur Durchführung einer vakuumbasierten physikalischen Gasphasenabscheidung angewendet wird, liegt die Aufgabe zugrunde, eine Magnetronsputtereinrichtung zu schaffen, mittels derer ein homogenerer Verbrauch des Targetmaterials und eine Minimierung der Spurenbildung auf dem zu beschichtenden Substrat erreicht werden können. Diese wird durch eine Magnetronsputtereinrichtung gelöst, umfassend ein Target, das Targetmaterial mit einer abzutragenden Targetoberfläche aufweist, sowie eine Magnetanordnung zum Konzentrieren eines Plasmas über der Targetoberfläche, die auf der der Targetoberfläche gegenüberliegenden Seite relativ und parallel zur Targetoberfläche beweglich angeordnet ist, wobei die Magnetanordnung durch mindestens einen Hydraulikaktor, der mindestens eine erste Wirkrichtung hat und der mit der Magnetanordnung in Wirkverbindung steht, in der ersten Wirkrichtung bewegbar ist.</description><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140109&DB=EPODOC&CC=DE&NR=102012211664A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140109&DB=EPODOC&CC=DE&NR=102012211664A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HEINRICH, HANS-JUERGEN.</creatorcontrib><title>Magnetron sputtering device, used to perform vacuum-based physical vapor deposition for coating substrate with target material, includes magnet assembly that concentrates plasma over target surface and comprises hydraulic actuator</title><description>The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction. The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction opposite to the first operating direction, is present operating connection with the hydraulic actuator or the magnet assembly, and is movable in the second operating direction. The restoring member is a further hydraulic actuator. The hydraulic actuators are arranged to each other such that directions of the actuator are perpendicular to each other. The hydraulic actuator is configured as a hydraulic cylinder and as a hydraulic muscle. The magnetron sputtering device further comprises a coolant inlet and a coolant outlet for cooling of the target and the magnet assembly by a cooling agent, and a control valve (8) for controlling a flow rate of a hydraulic fluid to the hydraulic actuator. The inlet and outlet are arranged on a hydraulic fluid port of the hydraulic actuator such that a partial volume of a flow of the coolant is used as the hydraulic fluid for the hydraulic actuator. The control valve is arranged so to the flow of the hydraulic fluid is moved to a first end position of the magnet assembly in first operating direction and the flow of the hydraulic fluid is moved to a second end position of the magnet assembly in the second operating direction. The magnet assembly is movable in the first operating direction.
Die Erfindung, welche eine Magnetronsputtereinrichtung betrifft, wie sie zur Durchführung einer vakuumbasierten physikalischen Gasphasenabscheidung angewendet wird, liegt die Aufgabe zugrunde, eine Magnetronsputtereinrichtung zu schaffen, mittels derer ein homogenerer Verbrauch des Targetmaterials und eine Minimierung der Spurenbildung auf dem zu beschichtenden Substrat erreicht werden können. Diese wird durch eine Magnetronsputtereinrichtung gelöst, umfassend ein Target, das Targetmaterial mit einer abzutragenden Targetoberfläche aufweist, sowie eine Magnetanordnung zum Konzentrieren eines Plasmas über der Targetoberfläche, die auf der der Targetoberfläche gegenüberliegenden Seite relativ und parallel zur Targetoberfläche beweglich angeordnet ist, wobei die Magnetanordnung durch mindestens einen Hydraulikaktor, der mindestens eine erste Wirkrichtung hat und der mit der Magnetanordnung in Wirkverbindung steht, in der ersten Wirkrichtung bewegbar ist.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjr1Ow1AMhbMwoMI7eGFrpSag7ghasbCxV86Nk1zp_sn2DcoL8xw4CHYmS0ff-Y5vm693nBIp5wRSqiqxTxMMtHhHe6hCA2iGQjxmjrCgqzUeetzyMq_iHQZLS2brlCxevZmMBZdRN5XUXpRRCT69zqDIEylE3JYw7MEnF-pAYtH2CKAIxT6soDOqWZKj9NMXKAElIuSF-M8jlUd0BJgGY2NhLwbO68BYg3eATitq5rvmZsQgdP97d83D5fzx8nawp68kxRw2fn09t8fu2HZd255OT8_t43-5b5UFcvQ</recordid><startdate>20140109</startdate><enddate>20140109</enddate><creator>HEINRICH, HANS-JUERGEN.</creator><scope>EVB</scope></search><sort><creationdate>20140109</creationdate><title>Magnetron sputtering device, used to perform vacuum-based physical vapor deposition for coating substrate with target material, includes magnet assembly that concentrates plasma over target surface and comprises hydraulic actuator</title><author>HEINRICH, HANS-JUERGEN.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE102012211664A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HEINRICH, HANS-JUERGEN.</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HEINRICH, HANS-JUERGEN.</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Magnetron sputtering device, used to perform vacuum-based physical vapor deposition for coating substrate with target material, includes magnet assembly that concentrates plasma over target surface and comprises hydraulic actuator</title><date>2014-01-09</date><risdate>2014</risdate><abstract>The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction. The magnetron sputtering device comprises a target of material (2) having a surface to be removed, and a magnet assembly for concentrating a plasma over the target surface. The magnet assembly is arranged opposite to a side of the target surface, is moved parallel with respective to the target surface, and comprises a hydraulic actuator and a restoring member. The hydraulic actuator includes a first operating direction, is present in operating connection with the magnet assembly, and is movable in the first operating direction. The restoring member comprises second operating direction opposite to the first operating direction, is present operating connection with the hydraulic actuator or the magnet assembly, and is movable in the second operating direction. The restoring member is a further hydraulic actuator. The hydraulic actuators are arranged to each other such that directions of the actuator are perpendicular to each other. The hydraulic actuator is configured as a hydraulic cylinder and as a hydraulic muscle. The magnetron sputtering device further comprises a coolant inlet and a coolant outlet for cooling of the target and the magnet assembly by a cooling agent, and a control valve (8) for controlling a flow rate of a hydraulic fluid to the hydraulic actuator. The inlet and outlet are arranged on a hydraulic fluid port of the hydraulic actuator such that a partial volume of a flow of the coolant is used as the hydraulic fluid for the hydraulic actuator. The control valve is arranged so to the flow of the hydraulic fluid is moved to a first end position of the magnet assembly in first operating direction and the flow of the hydraulic fluid is moved to a second end position of the magnet assembly in the second operating direction. The magnet assembly is movable in the first operating direction.
Die Erfindung, welche eine Magnetronsputtereinrichtung betrifft, wie sie zur Durchführung einer vakuumbasierten physikalischen Gasphasenabscheidung angewendet wird, liegt die Aufgabe zugrunde, eine Magnetronsputtereinrichtung zu schaffen, mittels derer ein homogenerer Verbrauch des Targetmaterials und eine Minimierung der Spurenbildung auf dem zu beschichtenden Substrat erreicht werden können. Diese wird durch eine Magnetronsputtereinrichtung gelöst, umfassend ein Target, das Targetmaterial mit einer abzutragenden Targetoberfläche aufweist, sowie eine Magnetanordnung zum Konzentrieren eines Plasmas über der Targetoberfläche, die auf der der Targetoberfläche gegenüberliegenden Seite relativ und parallel zur Targetoberfläche beweglich angeordnet ist, wobei die Magnetanordnung durch mindestens einen Hydraulikaktor, der mindestens eine erste Wirkrichtung hat und der mit der Magnetanordnung in Wirkverbindung steht, in der ersten Wirkrichtung bewegbar ist.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Magnetron sputtering device, used to perform vacuum-based physical vapor deposition for coating substrate with target material, includes magnet assembly that concentrates plasma over target surface and comprises hydraulic actuator |
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