Galvanizing mask, used to prepare printed conductor structure on substrate by galvanizing, includes reticulated carrier, on which dielectric mask is located, where carrier is formed in planar, cylindrical and electrically conductive manner
The galvanizing mask (1) comprises a reticulated carrier (2), on which a dielectric mask (3) is located. The carrier: is formed in a planar, a cylindrical and an electrically conductive manner; and is partially elastic. The mask is partially made of plastic and/or ceramic. Independent claims are inc...
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Zusammenfassung: | The galvanizing mask (1) comprises a reticulated carrier (2), on which a dielectric mask (3) is located. The carrier: is formed in a planar, a cylindrical and an electrically conductive manner; and is partially elastic. The mask is partially made of plastic and/or ceramic. Independent claims are included for: (1) a coating apparatus for producing printed conductor structures on a substrate by galvanizing; and (2) a method for producing printed conductor structures on a substrate by galvanizing.
Die vorliegende Erfindung betrifft eine Galvanisierungsmaske zur Herstellung von Leiterbahnstrukturen auf einem Substrat durch Galvanisieren, mit einem netzartigen Träger, auf welchem eine dielektrische Maske angeordnet ist. Ferner ist eine Beschichtungsvorrichtung und ein Verfahren zur Herstellung von Leiterbahnstrukturen auf einem Substrat durch Galvanisieren offenbart. |
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