Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess
The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the rece...
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| creator | GOH, GIM-WAE SEE, HONG-PENG CHANG, SENG-TEONG OOI, CHEE-ENG |
| description | The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the recesses are extended in parallel to each other. A contact material is provided for surrounding the recess. An independent claim is included for a method for manufacturing external electrical contact of semiconductor component.
Es wird ein Halbleiterbauelement (1) mit einem Kontakt (2) zur externen elektrischen Kontaktierung des Halbleiterbauelements mit einer Bond-Verbindung (4) abgegeben, wobei der Kontakt eine Strukturierung (3) mit zumindest einer Vertiefung (30) aufweist. Weiterhin wird ein Verfahren zur Herstellung einer externen elektrischen Kontaktierung angegeben. |
| format | Patent |
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Es wird ein Halbleiterbauelement (1) mit einem Kontakt (2) zur externen elektrischen Kontaktierung des Halbleiterbauelements mit einer Bond-Verbindung (4) abgegeben, wobei der Kontakt eine Strukturierung (3) mit zumindest einer Vertiefung (30) aufweist. Weiterhin wird ein Verfahren zur Herstellung einer externen elektrischen Kontaktierung angegeben.</description><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140424&DB=EPODOC&CC=DE&NR=102012109995A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140424&DB=EPODOC&CC=DE&NR=102012109995A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOH, GIM-WAE</creatorcontrib><creatorcontrib>SEE, HONG-PENG</creatorcontrib><creatorcontrib>CHANG, SENG-TEONG</creatorcontrib><creatorcontrib>OOI, CHEE-ENG</creatorcontrib><title>Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess</title><description>The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the recesses are extended in parallel to each other. A contact material is provided for surrounding the recess. An independent claim is included for a method for manufacturing external electrical contact of semiconductor component.
Es wird ein Halbleiterbauelement (1) mit einem Kontakt (2) zur externen elektrischen Kontaktierung des Halbleiterbauelements mit einer Bond-Verbindung (4) abgegeben, wobei der Kontakt eine Strukturierung (3) mit zumindest einer Vertiefung (30) aufweist. Weiterhin wird ein Verfahren zur Herstellung einer externen elektrischen Kontaktierung angegeben.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjr1OA0EMhK-hQMA7uKGD6C4oxZUIguihj8zu5M7Sxl7tOvy8Mk_B3SltJCrLM-NvfNn8vuEgwTQeg1uhYIdsCnXCalhR4opCUSyCwiiZRq5TRp2DU7biYko-spNUysU-JSLSfgLh21GUU_oh1khICF4kLMIJIDpQPdP-JT7Sx2TMoUU-arxbUJl9Rs_G2Q-WcyTTgX1aCwJqvW4u9pwqbk7zqrl92b4_vd4j2w41c4DCd8_brl233bpr-77fPHYP_839AQk_dBE</recordid><startdate>20140424</startdate><enddate>20140424</enddate><creator>GOH, GIM-WAE</creator><creator>SEE, HONG-PENG</creator><creator>CHANG, SENG-TEONG</creator><creator>OOI, CHEE-ENG</creator><scope>EVB</scope></search><sort><creationdate>20140424</creationdate><title>Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess</title><author>GOH, GIM-WAE ; SEE, HONG-PENG ; CHANG, SENG-TEONG ; OOI, CHEE-ENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE102012109995A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GOH, GIM-WAE</creatorcontrib><creatorcontrib>SEE, HONG-PENG</creatorcontrib><creatorcontrib>CHANG, SENG-TEONG</creatorcontrib><creatorcontrib>OOI, CHEE-ENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOH, GIM-WAE</au><au>SEE, HONG-PENG</au><au>CHANG, SENG-TEONG</au><au>OOI, CHEE-ENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess</title><date>2014-04-24</date><risdate>2014</risdate><abstract>The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the recesses are extended in parallel to each other. A contact material is provided for surrounding the recess. An independent claim is included for a method for manufacturing external electrical contact of semiconductor component.
Es wird ein Halbleiterbauelement (1) mit einem Kontakt (2) zur externen elektrischen Kontaktierung des Halbleiterbauelements mit einer Bond-Verbindung (4) abgegeben, wobei der Kontakt eine Strukturierung (3) mit zumindest einer Vertiefung (30) aufweist. Weiterhin wird ein Verfahren zur Herstellung einer externen elektrischen Kontaktierung angegeben.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess |
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