Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess
The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the rece...
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| Sprache: | eng ; ger |
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| Zusammenfassung: | The semiconductor component (1) has a contact portion (2) that is provided for externally and electrically contacting the semiconductor component with a bonding compound. A patterning portion (3) of contact portion is provided with an elongated recess (30). Main extending directions (31) of the recesses are extended in parallel to each other. A contact material is provided for surrounding the recess. An independent claim is included for a method for manufacturing external electrical contact of semiconductor component.
Es wird ein Halbleiterbauelement (1) mit einem Kontakt (2) zur externen elektrischen Kontaktierung des Halbleiterbauelements mit einer Bond-Verbindung (4) abgegeben, wobei der Kontakt eine Strukturierung (3) mit zumindest einer Vertiefung (30) aufweist. Weiterhin wird ein Verfahren zur Herstellung einer externen elektrischen Kontaktierung angegeben. |
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