Method for electrically connecting e.g. capacitor with ceramic circuit carrier, involves providing surface mounted device component with surfaces, and connecting component terminals with strip conductors of circuit carrier by bonding wires

The method involves providing a surface mounted device (SMD) component (1) with surfaces (3, 4), where one of the surfaces is provided with solderable, electrically conductive component terminals (2). The other surface of the component is connected with space in a circuit carrier (5) by an adhesive...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PECHTOLD, MICHAEL, GRUEBL, WOLFGANG
Format: Patent
Sprache:eng ; ger
Schlagworte:
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