Device, useful for introducing linear recesses in a substrate by means of a laser beam, comprises at least one deflection unit movable along a tracking axis parallel to a transport axis, for deflecting several laser beams on substrate

Device (1) for introducing, preferably linear recesses (2) in a substrate (3) by means of a laser beam (4), comprises at least one deflection unit movable along a tracking axis parallel to a transport axis, for deflecting several laser beams on the substrate. The substrate is driven by means of a transport unit (5) movable in a flow direction along the transport axis. The laser beam is deflected along a main axis extending transversely to the flow direction, for introducing the recesses. An independent claim is also included for introducing the recesses in the substrate, by means of the laser beam, comprising (i) continuously moving the substrate, by means of the transport unit, in the flow direction along the transport axis, and (ii) deflecting the laser beam along the main axis extending transversely to the flow direction, where several laser beams are simultaneously deflected on the substrate, and respective laser beam is deflected along the tracking axis parallel to the transport axis by the deflection unit movable along the tracking axis independently of the other laser beams and the movement of the substrate in the flow direction, the position and orientation of previously introduced- and recognized recesses and/or the required distance between the recesses are adjusted or balanced from each other. Die Erfindung betrifft eine Vorrichtung (1) und ein Verfahren zum Einbringen von linienförmigen Ausnehmungen (2) in ein Substrat (3) mittels mehrerer Laserstrahlen. Während das Substrat (3) mittels einer Transporteinheit (5) mit einer kontinuierlichen Vorschubgeschwindigkeit entlang einer Transportachse (7) gefördert wird, werden die jedem Laserstrahl zugeordneten Ablenkeinheiten (8) in Richtung einer Hauptachse (10) quer zu der Durchlaufrichtung (6) des Substrats (3) bewegt. Jede Ablenkeinheit (8) hat darüber hinaus eine individuelle Nachführachse (11) parallel zu der Transportachse (7), durch die insbesondere eine synchrone Bewegung des Laserstrahls erreicht wird. Zugleich werden bei der Steuerung der Nachführachse (11) auch erfasste Messwerte eventueller Verformungen des Substrats (3), insbesondere aufgrund der thermischen Einflüsse, sowie die Ist-Position zuvor eingebrachter Ausnehmungen (2) und der gewünschte Abstand benachbarter Ausnehmungen (2) berücksichtigt.