Verfahren und Steuervorrichtung zur Reinigung einer Plasmabehandlungsvorrichtung und/oder eines in einer Plasmabehandlungsvorrichtung aufgenommenen Substrats

Verfahren zur Reinigung einer Plasmabehandlungsvorrichtung (1) und/oder eines in einer Plasmabehandlungsvorrichtung (1) aufgenommenen Substrats (2), wobei die Plasmabehandlungsvorrichtung (1) wenigstens drei Plasmaeinheiten (28) umfasst, die zur Erzeugung wenigstens einer durch die Plasmabehandlungsvorrichtung (1) fortschreitenden Plasmawelle derart sequentiell gezündet werden, dass eine sich von einer Seite der Plasmabehandlungsvorrichtung (1) zu deren anderer Seite fortschreitende Plasmawelle erzeugt wird oder gleichzeitig mindestens zwei Plasmawellen erzeugt werden, die in der Plasmabehandlungsvorrichtung in entgegengesetzte Richtungen laufen. The device for treating a substrate (2) using plasma, comprises plasma units for generating plasma in a plasma region of the plasma units, where the plasma region of the first plasma unit overlaps an emission region of the two adjacent second plasma units, and a control arrangement to control the first and second plasma units independent from one another. The first plasma unit has an ignition output that is smaller than the ignition output of the second plasma unit. The first plasma unit is arranged external of a projection area of the substrate to be treated. The device for treating a substrate (2) using plasma, comprises plasma units for generating plasma in a plasma region of the plasma units, where the plasma region of the first plasma unit overlaps an emission region of the two adjacent second plasma units, and a control arrangement to control the first and second plasma units independent from one another. The first plasma unit has an ignition output that is smaller than the ignition output of the second plasma unit. The first plasma unit is arranged external of a projection area of the substrate to be treated. The first plasma unit is removable from the surface of the substrate to be treated as the second plasma unit. The second plasma unit has rod-shaped microwave antennas.